AMS · BESI.AS
BE Semiconductor Industries N.V.
€163.35+€1.80 (+1.11%)
BE Semiconductor Industries N.V.’s quoted price sits in the lower half of its reported 52-week range, 50.26% below the high.
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NYSE · ASX · USD
Stock price, dividends, earnings
Quote as of Oct 29, 2026, 08:00 PM UTC. Cached market data; not a live quote.
One-year closing-price history · USD. Historical prices are not a forecast.
ASE Technology Holding Co., Ltd.’s quoted price sits in the upper half of its reported 52-week range, 7.05% below the high.
52-week range
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THE INCOME SIDE
ASE Technology Holding Co., Ltd.’s forward annual dividend is $0.40 per share, paid annual. The forward yield is 0.91% at the quoted price. Future payments can change.
Historical amounts are adjusted for stock splits. Understand ex-dividend and payment dates →
BEHIND THE RESULTS
ASE Technology Holding Co., Ltd.’s next earnings report is currently expected on Feb 4, 2027, with estimated earnings per share of $0.38. The reporting date and estimates may change.
Upcoming dates and analyst estimates may change. Fiscal quarters follow ASE Technology Holding Co., Ltd.’s reporting calendar.
THE COMPANY BEHIND THE TICKER
Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
About this data · PortfolioX market data, also available in the mobile app. Prices are displayed in the listing currency; dividend amounts use the currency shown in that section. Data availability and update times vary.
Page generated Oct 29, 2026, 10:06 PM UTC. Quotes retain their own timestamp above. Missing values appear as a dash. This page is for information only, not personalized investment advice.
Completed calendar years and any current-year payments shown separately. Current-year totals are incomplete until all payments are made.
See annual income at the current dividend rate.
Assumes the annual dividend stays unchanged. Payments follow the company’s schedule. Excludes taxes, fees and currency changes.
| Q2 2025 | Jul 31, 2025 | $0.11-23.24% vs estimate | $5.20B+8.45% vs estimate |
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| Q1 2025 | Apr 30, 2025 | $0.10-7.15% vs estimate | $4.47B+1.88% vs estimate |
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| Q4 2024 | Feb 13, 2025 | $0.13+2.52% vs estimate | $4.94B+0.05% vs estimate |
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Latest available per-share figures in USD. The payout ratio compares dividends with earnings.
THE ANALYST VIEW
5 ratings in the current snapshot. Strong buy and strong sell are grouped with buy and sell.
HOW THE BUSINESS IS PERFORMING
Statement amounts use the company’s reporting currency and are not converted to the stock’s listing currency. K = thousand, M = million, B = billion, T = trillion. Cash-flow figures are matched by fiscal year; missing figures appear as a dash.
PUT THE NUMBERS IN CONTEXT
Current metrics alongside available historical medians. A lower multiple or higher margin alone does not establish whether a stock is a good investment.
KEEP COMPARING
€163.35+€1.80 (+1.11%)
BE Semiconductor Industries N.V.’s quoted price sits in the lower half of its reported 52-week range, 50.26% below the high.
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