SHH · 601138.SS
Foxconn Industrial Internet Co., Ltd.
CN¥45.22-CN¥3.42 (-7.03%)
Foxconn Industrial Internet Co., Ltd.’s quoted price sits in the lower half of its reported 52-week range, 46.77% below the high.
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SHH · 603005.SS · CNY
Stock price, dividends, earnings
Quote as of Oct 29, 2026, 07:00 AM UTC. Cached market data; not a live quote.
One-year closing-price history · CNY. Historical prices are not a forecast.
China Wafer Level CSP Co., Ltd.’s quoted price sits in the lower half of its reported 52-week range, 61.44% below the high.
52-week range
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THE INCOME SIDE
China Wafer Level CSP Co., Ltd.’s forward annual dividend is CN¥0.12 per share, paid annual. The forward yield is 0.56% at the quoted price. Future payments can change.
Historical amounts are adjusted for stock splits. Understand ex-dividend and payment dates →
BEHIND THE RESULTS
China Wafer Level CSP Co., Ltd.’s next earnings report is currently expected on Oct 31, 2026, with estimated earnings per share of CN¥0.21. The reporting date and estimates may change.
Upcoming dates and analyst estimates may change. Fiscal quarters follow China Wafer Level CSP Co., Ltd.’s reporting calendar.
THE COMPANY BEHIND THE TICKER
China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services, as well as packaging and testing services. In addition, the company offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives, as well as FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. Further, it engages in research and development; patent management; field application promotion; investment management; and technology development activities. It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
Latest available per-share figures in CNY. The payout ratio compares dividends with earnings.
About this data · PortfolioX market data, also available in the mobile app. Prices are displayed in the listing currency; dividend amounts use the currency shown in that section. Data availability and update times vary.
Page generated Oct 29, 2026, 09:07 PM UTC. Quotes retain their own timestamp above. Missing values appear as a dash. This page is for information only, not personalized investment advice.
Completed calendar years and any current-year payments shown separately. Current-year totals are incomplete until all payments are made.
See annual income at the current dividend rate.
Assumes the annual dividend stays unchanged. Payments follow the company’s schedule. Excludes taxes, fees and currency changes.
| Q3 2024 |
|---|
| Oct 29, 2024 |
| CN¥0.11 |
| CN¥294.55M |
HOW THE BUSINESS IS PERFORMING
Statement amounts use the company’s reporting currency and are not converted to the stock’s listing currency. K = thousand, M = million, B = billion, T = trillion. Cash-flow figures are matched by fiscal year; missing figures appear as a dash.
PUT THE NUMBERS IN CONTEXT
Current metrics alongside available historical medians. A lower multiple or higher margin alone does not establish whether a stock is a good investment.
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